Mr. Sudarshan

Title: Synthesis of novel materials and design of MEMS based structures for Uncooled infrared microbolometer The research work is aimed to investigate manganite materials with high temperature coefficient of resistance (TCR) and room temperature metal to semiconductor/insulator (TMI) transition. Room temperature TMI with high TCR material is prominent candidate for uncooled infrared microbolometer applications. Uncooled infrared microbolometer is very useful in night vision systems, automotive thermal imaging, security, fire detection and military purposes, etc. The thin films of these manganites are developing on Si(100)-substrate by using chemical solution deposition method and integration of these thin films to MEMS components for the development of MEMS-based uncooled microbolometer for Infrared detector

His Research Works..

Mr. Mujeeb (Class of 2013)

For most micro-mechanical devices, a high precision alignment of mask pattern to crystal orientation is preferred. Since the etching rate of anisotropic wet etching of silicon is highly orientation-dependent, it is important to determinate the crystallographic orientation before etching. The exact structure of the desired pattern mainly depends on how accurately the mask edge is aligned with the wafer flat. A small degree of misalignment of the mask edge with the wafer flat or a minor manufacturing error in the wafer flat orientation results in significant change in the desired structures. Several studies have been carried out by many researchers by which only single crystal orientations can be found out using a single mask pattern. The current study presents design of a mask that can be employed for different crystal orientations of the wafer(e.g. {100},{110} and {111}) to create pre etched pattern for the precise alignment of mask patterns along the various crystallographic directions for the development of three dimensional microstructures using the wet chemical based silicon micromachining. The verification and validation of the proposed mask design is done by simulation using IntelliEtch software.

His Research Works..

Mr. Subhomoy Haldar

In the fabrication of silicon based MEMS using wet etching, two kinds of corners namely convex and concave are encountered. Sharp convex and concave corner are frequently used in MEMS structure. It is observed that unlike convex corner there is no undercutting takes place at concave corner. The characteristics of undercutting at convex corner depend on the type of etchant used for etching process. My research work focuses on the thorough study of undercutting planes at convex corner in different kinds of alkaline solutions.

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Mr. Aasish Kumar

I am pursuing M.Sc (Physics) in the Department of Physics. My project work is in the area of Silicon Anodic Oxidation.

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Mr. Sumit Premee

I am pursuing my M.Tech (Nanotechnology) from University of Rajasthan, Jaipur. I joined MEMS and Micro/nano systems Lab in Nov 2013 to do my thesis work. Presently my research work focuses on Texturization of monocrystalline silicon wafer in different kinds of TMAH solutions for solar cell applications

His Research Works..

Mr. Ravindra

My recent research work has been focused on Manganite material with doping of Ag(Silver) for application of Microbolometer to study enhanced TCR effect with room temperature TMI. Manganite material is suspended layer Absorbing material for Uncooled microbolometer. Manganites show complex electronic and magnetic properties and very rich phase diagram. Almost all the degrees of freedom known in solid state physics, namely itinerant charges, localized spins, electronic orbitals and lattice vibrations, are at play. Various ground states are possible as a function of doping, x and temperature, T. Manganites show insulating states which can be paramagnetic(PI), ferromagnetic(FI) as well as anti-ferromagnetic(AFI).

His Research Works..

Mr. Sajal Sagar Singh

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My recent research work has been to focus on explaining the reason of undercutting at the convex corner in the simplest and robust way,there have been lots of research in order to explain the phenomenon of undercutting at the convex corner but I am trying to present the simplest model that explains this phenomenon and is valid even in the case of a surfactant added etchant. I am also working on Thin Film Deposition Techniques where I am trying to develop a model that can predict the profile of the deposition on various trenches on Si wafers, presently I am doing my research in this area.

His Research Works..