(Complete list of publications in standard refereed journals)


67. Bonam, Satish; Panigrahi, Asisa Kumar; Cheemalamarri, Hemanth Kumar; Vanjari, Siva Rama Krishna; Singh, Shiv Interface and reliability analysis of Au passivated Cu-Cu fine pitch thermocompression bonding for 3D IC applications Accepted for Publication in IEEE Transection on Components, Packaging and Manufacturing Technology, 10.1109/TCPMT.2019.2912891
66. Suryasnata Tripathy, Vasundhra Bhandari Paresh Sharma, Siva Rama Krishna Vanjari Shiv Govind Singh Chemiresistive DNA hybridization sensor with electrospun nanofibers: A method to minimize inter-device variability Biosensors & Bioelectronics. 133, (2019); 24-311
65. Srinivasulu Kanaparthi, Shiv Govind Singh Solvent-free fabrication of a room temperature ammonia gas sensor by frictional deposition of a conducting polymer on paper Organic Electronics 68, (2019); 108-112
64. Patta Supraja, Suryasnata Tripathy, Siva Vanjari, Vikrant Singh, Shiv Govind Singh Label free, electrochemical detection of Atrazine using electrospun Mn2O3 nanofibers: Towards ultrasensitive small molecule detection. Sensors and Actuators B Chemical 285 (2019); 317-325 DOI:10.1016/j.snb..01.060
63. Srinivasulu Kanaparthi, Shiv Govind Singh Chemiresistive Sensor Based on Zinc Oxide Nanoflakes for CO2 Detection ACS Applied Nano Material. 2 (2) (2019); 700–706 2019;DOI:10.1021/acsanm.8b01763
62. Srinivasulu Kanaparthi, Santu Kayal, Shiv Govind Singh Simple and facile microfabrication of a flexible interdigitated capacitor for sensing application Flexible and printed electronics. (2019); 014001-015007
61. Patta Supraja, Vadnala Sudarshan, Suryasnata Tripathy, Amit Agrawal, Shiv Govind Singh Label free electrochemical detection of cardiac biomarker Troponin T using ZnSnO3 perovskite nanomaterials Analytical methods 11, (2019); 744-751 DOI:10.1039/C8AY02617C
60. Venkatesh Eliganti, Suraj Singh, Suryasnata Tripathy, Shiv Govind Singh Amorphous-Carbon / Si heterojunction device for room-temperature NH3 sensing Sensors Letters (99) (2019);1-1., DOI:10.1109/LSENS.2018.2887255
59. Suryasnata Tripathy, Jose Joseph, Siva Rama Krishna Vanjari, Avss Narayana Rao, Shiv Govind Singh Flexible ITO Electrode With Gold Nanostructures for Femtomolar DNA Hybridization Detection. IEEE Sensors Letters 2(4) (2019);1-4., DOI:10.1109/LSENS.2018.2874232
58. Sudharshan Vadnala, Suryasnata Tripathy, Nirupam Paul, Amit Agrawal, Shiv Govind Singh Facile Synthesis of Electrospun Nickel (II) Oxide Nanofibers and Its Application for Hydrogen Peroxide Sensing. Chemistry Select 3(43) (2018); 12263-12268, doi.org/10.1002/slct.201802526
57. Suryasnata Tripathy, Manne Shanmukh Reddy, Siva Rama Krishna Vanjari, Soumya Jana, Shiv Govind Singh A Step Towards Miniaturized Milk Adulteration Detection System: Smartphone-Based Accurate pH Sensing Using Electrospun Halochromic Nanofibers Food Analytical Methods 12 (2), (2019); 612–624
56. Sanni Kumar, Suryasnata Tripathy, Anupam Jyoti, Shiv Govind Singh: Recent advances in biosensors for diagnosis and detection of sepsis Biosensors & Bioelectronics, 15, (2019); 124-125 DOI:10.1016/j.bios.2018.10.034
55. Nirupam Paul, Sudharshan Vadnala, Asisa Kumar Panigrahi, C. Hemanth Kumar, Amit Agrawal, Shiv Govind Singh: Vanadium Pentoxide Nanofibers as IR Sensors for Bolometer Applications. ECS Transactions 85(13), (2018);1573-1583., DOI:10.1149/08513.1573ecst
54. Suryasnata Tripathy, Rahul Gangwar, Patta Supraja, AVSS Narayana Rao, Siva Rama Krishna Vanjari, Shiv Govind Singh: Graphene Doped Mn2O3 Nanofibers as a Facile Electroanalytical DNA Point Mutation Detection Platform for Early Diagnosis of Breast/Ovarian Cancer. Electroanalysis 30(9), (2018); 2110-2120 , DOI:10.1002/elan.201800220
53. Sankatali Venkateswarlu, Akhil Sudarsanan, Shiv Govind Singh, Kaushik Nayak Ambient Temperature-Induced Device Self-Heating Effects on Multi-Fin Si n-FinFET Performance. IEEE Transactions on Electron Devices 99 (2018); 1-8., DOI:10.1109/TED.2018.2834979
52. Sudharshan Vadnala, Nirupam Paul, Shiv Govind Singh Enhanced infrared sensing properties of vanadium pentoxide nanofibers for bolometer application Materials Science in Semiconductor Processing 81, (2018), 82-88, DOI:10.1016/j.mssp.2018.03.018
51. Jose Joseph, Shiv Govind Singh, Siva Rama Krishna Vanjari Piezoelectric Micromachined Ultrasonic Transducer Using Silk Piezoelectric Thin Film IEEE Electron Device Letters 39-5, (2018); 749 - 752
50. Jose Joseph, Shiv Govind Singh, Siva Rama Krishna Vanjari Fabrication and characterization of SU-8-based capacitive micromachined ultrasonic transducer for airborne applications. Journal of Micro/ Nanolithography, MEMS, and MOEMS 17(01) (2018; DOI:10.1117/1.JMM.17.1.015003
49. Asisa Kumar Panigrahi, C. Hemanth Kumar, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh Optimized ultra-thin manganin alloy passivated fine-pitch damascene compatible bump-less Cu–Cu bonding at sub 200 °C for three-dimensional Integration applications. Japanese Journal of Applied Physics \ 57(2S1) (2018); 02BC04., DOI:10.7567/JJAP.57.02BC04
48. Asisa Kumar Panigrahi, Tamal Ghosh, C. Hemanth Kumar, Siva Rama Krishna Vanjari, Shiv Govind Singh Direct, CMOS In-Line Process Flow Compatible, Sub 100 °C Cu–Cu Thermocompression Bonding Using Stress Engineering. Electronic Materials Letters 14(3), (2018); 328–335. DOI:10.1007/s13391-018-0037
47. Aravinth Kumar A R, Shiv Govind Singh, Ashudeb Dutta Analytical Design Technique for Real-to-Real Single and Dual Frequency Impedance Matching Networks in Lossy Passive Environment IET Microwaves Antennas & Propagation 12(6), (2018), 1013 - 1020 DOI:10.1049/iet-map.2017.0780
46. K. BrincePaulSiva Rama KrishnaVanjari, Shiv GovindSingh Highly Sensitive Electrospun Multiwalled Carbon Nanotubes Embedded Zinc Oxide Nanowire Based Interface for Label Free Biosensing Procedia Technology 27, (2017); Pages 217-218
45. K. Brince Paul, Sanni Kumar, Suryasnata Tripathy, Vikrant Singh, Siva Rama Krishna Vanjari, Shiv Govind Singh Highly-sensitive Label-free Differential Pulse Voltammetric Immunosensor for Diagnosis of Infectious Diseases Based on Electrospun Copper Doped ZnO Nanofiber Biosensing Platform Procedia Technology 27, (2017); 219-220., DOI:10.1016/j.protcy.2017.04.092
44. Brince Paul,A. K. Panigrahi, V. Singh, Shiv Govind Singh. Non lithographic fabrication of plastic based –nanofiber integrated microfluidic Biochip for sensitive Detection of Infectious Biomarkers ACS Applied materials and Interfaces, 9 (46), (2017), 39994–40005.
43. Jose Joseph, Shiv Govind Singh, Siva Rama Krishna Vanjari Leveraging Innate Piezoelectricity of Ultra-Smooth Silk Thin Films for Flexible and Wearable Sensor Applications. IEEE Sensors Journal; 17924), (2017); 8306 - 8313 DOI:10.1109/JSEN.2017.2766163
42. A. Satya Trinadh, Seetal Potluri, Sobhan Babu Ch, V. Kamakoti, Shiv Govind Singh Optimal Don’t Care Filling for Minimizing Peak Toggles During At-Speed Stuck-At Testing. ACM Transactions on Design Automation of Electronic Systems 23(1), (2017); 1-26., DOI:10.1145/3084684
41. V.S. Duryodhan, Rajeswar Chatterjee, Shiv Govind Singh, Amit Agrawal Mixing in planar spiral microchannel Experimental Thermal and Fluid Science. 89, (2017), 119-127 DOI: 10.1016/j.expthermflusci.2017.07.024
40. Brince Paul,A. K. Panigrahi, V. Singh, Shiv Govind Singh A multi-walled carbon nanotube-zinc oxide nanofiber based flexible chemiresistive biosensor for malaria biomarker detection Analyst, 142, (2017); 2128-2135.
39. Tripathy, Suryasnata, Siva Rama Krishna Vanjari, Vikrant Singh, S. Swaminathan, and Shiv Govind Singh Electrospun Manganese (III) Oxide Nanofiber based Electrochemical DNA-Nanobiosensor for Zeptomolar Detection of Dengue Consensus Primer Biosensors and Bioelectronics 90 , (2017); 378-387,
38. Jose Joseph, shiv Govind singh, Siva R K Vanjari Ultra-Smooth E-beam Evaporated Amorphous Silicon Thin Films – A Viable Alternative for PECVD Amorphous Silicon Thin Films for MEMS Applications Materials Letters 197, (2017); 52-55 DOI:10.1016/j.matlet.2017.03.158
37. Asisa Kumar Panigrahi, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh Demonstration of Sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer. Materials Letters 194, (2017); 86-89 DOI:10.1016/j.matlet.2017.02.041
36. Vijay S Duryodhan, Shiv G Singh, Amit Agrawal Effect of Cross Aspect Ratio on Flow in Diverging and Converging Microchannels Journal of Fluids Engineering 139(6), (2017); 061203- 061211, DOI:10.1115/1.4035945
35. V.S. Duryodhan, S.G. Singh, Amit Agrawal Heat rate distribution in converging and diverging microchannel in presence of conjugate effect International Journal of Heat and Mass Transfer 104, (2017); 1022-1033., DOI:10.1016/j.ijheatmasstransfer.2016.09.014
34. Asisa Kumar Panigrahi, Tamal Ghosh, Siva Rama Krishna Vanjari, and Shiv Govind Singh Oxidation resistive, CMOS compatible Copper based Alloy ultrathin films as a superior passivation mechanism for achieving 150˚C Cu-Cu wafer on wafer thermocompression bonding IEEE Transactions on Electron Devices. 64(3), ,(2017), 1239-1245.
33. Durga Prakash Matta, Suryasnata Tripathy, Siva Rama Krishna Vanjari, Chandra Shekhar Sharma, Shiv G Singh An ultrasensitive label free nanobiosensor platform for the detection of cardiac biomarkers Biomedical Microdevices 18(6), (2016); 111-117 DOI:10.1007/s10544-016-0126-3
32. Matta Durga Prakash, Siva Rama, Krishna Vanjari, Chandra Shekhar Sharma, Shiv Govind Singh Ultrasensitive, Label Free, Chemiresistive Nanobiosensor Using Multiwalled Carbon Nanotubes Embedded Electrospun SU-8 Nanofibers Sensors 16(9), (2016); 1354. DOI:10.3390/s16091354
31. Suryasnata Tripathy , Aniket Ramesh Ghole , Khandavalli Deep , Siva Rama Krishna Vanjari , Shiv Govind Singh A comprehensive approach for milk adulteration detection using inherent bio-physical properties as ‘Universal Markers’: Towards a miniaturized adulteration detection platform. Journals of Food Chemistry, (2017); 756-765.
30. M. Durga Prakash, S. G. Singh, C. S. Sharma, V. Siva Rama Krishna: Electrochemical Detection of Cardiac Biomarkers Utilizing Electrospun Multiwalled Carbon Nanotubes Embedded SU-8 Nanofibers Electroanalysis 29(2), (2017); 380-386. DOI:10.1002/elan.201501163
29. Paul, K.B, Vikrant Singh,Siva Rama Krishna Vanjari ,Shiv Govind Singh One step biofunctionalized electrospun multiwalled carbon nanotubes embedded zinc oxide nanowire interface for highly sensitive detection of carcinoma antigen-125 Biosensors and Bioelectronics, 88, (2017); 144-148.
28. Paul, K. Brince, Sanni Kumar, Suryasnata Tripathy, Siva R.K Vanjari, Vikrant Singh, and Shiv Govind Singh A highly sensitive self assembled monolayer modified copper doped zinc oxide nanofiber interface for detection of Plasmodium falciparum histidine-rich protein-2: targeted towards rapid, early diagnosis of malaria Biosensors and Bioelectronics, 80 (2016); 39-46
27. V. S. Duryodhan, Abhimanyu Singh, S. G. Singh, Amit Agrawal Three-Dimensional Numerical Study of Conjugate Heat Transfer in Diverging Microchannel Proc Indian Natn Sci Acad 82 (2), (2016); 321-328 DOI:10.16943/ptinsa/2016/48423
26. Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Shiv Govind Singh Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure Materials Letters, 169, (2016); 269-272
25. V. S. Duryodhan, Abhimanyu Singh, Shiv Govind Singh, Amit Agrawal A simple and novel way of maintaining constant wall temperature in microdevices Scientific Reports 6, (2016); 18230., DOI:10.1038/srep18230
24. TAMAL GHOSH, Krushna Murthy K., Asisa Kumar Panigrahi, Asudeb Dutta, Subrahmanyam Ch, Siva Rama Krishna Vanjari, Shiv Govind Singh Facile Non Thermal Plasma based desorption of Self Assembled Monolayers for achieving low temperature and low pressure Cu-Cu thermocompression bonding. RSC Advances 5(125), (2015); 103643-103648 DOI:10.1039/C5RA17735A
23. Radharamana Mohanty, Chanda Karthik, Siva Rama Krishna Vanjari, Shiv Govind Singh Realizing Area efficient Silicon Micro Structures Using Only Front End Bulk Micromachining International Journal of Advances in Engineering Sciences and Applied Mathematics. (2015);91-197
22. Anesh K Sharma, Ashu K Gautam, Paola Farinelli, Asudeb Dutta, S G Singh A Ku band 5 bit MEMS phase shifter for active electronically steerable phased array applications Journal of Micromechanics and Microengineering 25(3), (2015)
21. V.S. Duryodhan, Abhimanyu Singh, S.G. Singh, Amit Agrawal Convective heat transfer in diverging and converging microchannels International Journal of Heat and Mass Transfer 80 (2015);424–438
20. V S Duryodhan, S G Singh, A Agrawal Liquid flow through converging microchannels and a comparison with diverging microchannels. Journal of Micromechanics and Microengineering. 24(12), (2015);
19. U. Chatterjee a, A. Das a, T. Ghosh c, S.P. Duttagupta a, S.G. Singh, M.N.Gandhi Effect of post deposition annealing on thermal evaporated ZnSe:Te towards a scintillator application Microelectronic Engineering 126(-), (2014); 84–87., DOI:10.1016/j.mee.2014.06.016
18. V S Duryodhan, S G Singh, AMIT AGRAWAL Boiling flow through diverging microchannel Sadhana 38(6), (2013) DOI:10.1007/s12046-013-0188-3
17. Nishant Kumar, Amit Prabhakar, Mukul Tikekar, Shiv Govind Singh, Amit Agrawal Blood flow in non-circular microchannel under pulsating condition. International Journal of Micro-Nano Scale Transport,; 4(1), (2013); 33–50. DOI:10.1260/1759-3093.4.1-2.33
16. Siddhartha Tripathi, Amit Prabhakar, Nishant Kumar, Shiv Govind Singh, Amit Agrawal Blood plasma separation in elevated dimension T-shaped microchannel Biomedical Microdevices 15(3), (2013); 415-25 DOI:10.1007/s10544-013-9738-z
15. Amit Agrawal, V S Duryodhan, S G Singh Pressure Drop measurements with boiling in diverging microchannel Frontiers in Heat and Mass Transfer 3(1), 92013); 013005., DOI:10.5098/hmt.v3.1.3005
14. R R Bhide, S G Singh, Vijay S Duryodhan, Arun kumar Sridharan, Amit Agrawal Onset of nucleate boiling and critical heat flux with boiling water in microchannels International Journal of Microscale and Nanoscale Thermal, (2013); 24-47
13. S.G. Singh, R.R. Bhide, S.P. Duttagupta, Arun kumar Sridharan, Amit Agrawal Experimental Study of Water Boiling in Microchannel Advances in Multiphase Flow and Heat Transfer 4, (2013); 188-229; DOI:10.2174/978160805228811201010188
12. V. S. Duryodhan, S. G. Singh, Amit Agrawal Liquid flow through a diverging microchannel. Microfluidics and Nanofluidics 14(1-2), 2012)., 53-67. DOI:10.1007/s10404-012-1022-7
11. Shiv Govind Singh, Amit Agrawal, Siddhartha P Duttagupta Reliable MOSFET operation using two-phase microfluidics in the presence of high heat flux transients Journal of Micromechanics and Microengineering 21(10), (2011);105002. DOI:10.1088/0960-1317/21/10/105002
10. Rohit R Bhide, Shiv G Singh, A Sridharan, Amit Agrawal An active control strategy for reduction of pressure instabilities during flow boiling in a microchannel Journal of Micromechanics and Microengineering 21(3), (2011); 035021., DOI:10.1088/0960-1317/21/3/035021
9. Mukul Tikekar, Shiv Govind Singh, Amit Agrawal Measurement and modeling of pulsatile flow in microchannel Microfluidics and Nanofluidics 9(6); (2010); 1225-1240. DOI:10.1007/s10404-010-0642-z
8. S.G. Singh, R.R. Bhide, S.P. Duttagupta, B.P. Puranik, Amit Agrawal Two-Phase Flow Pressure Drop Characteristics in Trapezoidal Silicon Microchannels IEEE Transactions on Components and Packaging Technologies. 32(4-32); (2010); 887 - 900., DOI:10.1109/TCAPT.2009.2019634
7. S.G. Singh, S. P. Duttagupta, and A. Agrawal Real-time impact analysis of very high heat flux transients and mitigation using on-chip single-phase and two phase microfluidics. JMEMS 18(6), (2009); 1208-1219.
6. C.S. Tan, L.D.Fatt, S.G. Singh, S. K. Goulet and M. Bergkvist Cu-Cu diffusion bonding enhancement at low temperature by surface passivation using self assembled monolayer of alkane-thiol Applied Physics Letters, 95,1 (2009).
5. R.R. Bhide, S.G. Singh, Arun Kumar Sridharan, S.P. Duttagupta, Amit Agrawal Pressure drop and heat transfer characteristics of boiling water in sub-hundred micron channel. Experimental Thermal and Fluid Science 33(6-33), (200); 963-975
4. S G Singh, A Jain, A Sridharan, S P Duttagupta, Amit Agrawal Flow map and measurement of void fraction and heat transfer coefficient using an image analysis technique for flow boiling of water in a silicon microchannel Journal of Micromechanics and Microengineering 19(7), (2009); 075004. DOI:10.1088/0960-1317/19/7/075004
3. Amit Agrawal, Shiv Govind Singh A review of state-of-the-art on flow boiling of water in microchannel. International Journal of Microscale and Nanoscale Thermal, 2(1)1(2011);1-34
2. S.G. Singh, A. Kulkarni, S.P. Duttagupta, B.P. Puranik, A. Agrawal Impact of aspect ratio on flow boiling of water in rectangular microchannels Experimental Thermal and Fluid Science. 33(1), (2008); 153-160
1. Kumar, N., Agrawal, A., Singh, S.G., Sridharan A. On bubble dynamics during flow boiling in microchannel Journal of Energy, Heat and Mass Transfer,. 37, (2105); 57- 64, (Invited article)

C104. Patta Supraja, Brince Paul K, Durga Prakash M, Shiv Govind Singh: Electrospun ZnO nanofiber based biosensor for electrochemical detection of Atrazine:
A step closer to single molecule detection. CMEMS- 2018, Carbon MEMS: New Horizons, December 5th -7th, 2018, Hyderabad, India;

C103. P. Supraja, S. Tripathy, V. Singh, R Singh, S R K Vanjari, S G Singh: Label Free, Ultrasensitive Immuno Detection Of Atrazine.
Biosensors 2018, 28th anniversary world congress on biosensors, 12-15 June 2018, Miami, Florida, USA;

C102. C Hemanth Kumar, Satish Bonam, Siva Rama Krishna Vanjari, and Shiv Govind Singh:
High Density metal alloy Interconnections Using Novel Wafer Bonding Approach For 3D IC Packaging Applications.
20th Electronics Packaging Technology Conference (EPTC), 4th -7th Dec 2018, Resorts World Sentosa, Singapore.

C101. Satish Bonam, C Hemanth Kumar, Siva Rama Krishna Vanjari, and Shiv Govind Singh : Gold Passivated Cu-Cu Bonding At 140˚C For 3D IC Packaging And Heterogeneous Integration Applications.
20th Electronics Packaging Technology Conference (EPTC), 4th -7th Dec 2018, Resorts World Sentosa, Singapore.

C100. Nirupam Paul, Shiv Govind Singh: Dependency of fT and fMAX on various Device Parameters of AlGaN/GaN HEMT. IEEE EDKCON 2018, Kolkata; 11/2018.

C99. Nirupam Paul, Sudarshan Vadnala, Amit Agrawal, Siva Vanjari, Shiv Govind Singh,Thermal and Optoelectrical analysis of La0.7Sr0.3MnO3
Thin Film Thermistor in 8-12 µm range for Uncooled Microbolometer Application, IEEE EDKCON 2018, Kolkata; 11/2018.

C98. Vijay Duryodhan, Rajeswar Chatterjee, Amit Agrawal and Shiv Govind Singh Title: Study of Mixing in Different Shapes of Spiral Microchannel 2018.

C97. C. Hemanth Kumar, Satish Bonam, Siva Rama Krishna Vanjari, Shiv Govind Singh:
Silicide based integration approach for fabricating highly reliable, hermitically sealed on-chip,
low form factor-microfluidics for 3D IC cooling applications. 2018 IEEE CPMT Symposium Japan (ICSJ); 11/2018, DOI:10.1109/ICSJ.2018.8602734

C96. Lisa Sarkar, Jose Joseph, Shiv Govind Singh, Siva Rama Krishna Vanjari: Modeling and Fabrication Aspects of PVDF as a Membrane Material for Air Borne PMUT Applications.
IEEE Sensors 2018, New Delhi, India; 10/2018, DOI:10.1109/ICSENS.2018.8589809

C95.Jose Joseph, Manish Yadav, Suryasnata Tripathy, G D V Santhosh Kumar, Shiv Govind Singh, Siva Rama Krishna Vanjari:
Exploring the Piezoelectric Property of Electrospun Silk Nanofibers for Sensing Applications.
IEEE Sensors 2018, New Delhi, India; 10/2018, DOI:10.1109/ICSENS.2018.8589774

C94.Jose Joseph, Manish Yadav, Suryasnata Tripathy, G D V Santhosh Kumar, Shiv Govind Singh, Siva Vanjari:
A Highly Flexible Tactile Sensor with Self-Poled Electrospun PVDF Nanofiber. IEEE Sensors 2018, New Delhi, India; 10/2018, DOI:10.1109/ICSENS.2018.8589807

C93.G D V Santhosh Kumar, Jose Joseph, Shiv Govind Singh, Siva Vanjari:
Selective Anisotropic Dry Etching of Piezoelectric Silk Microstructures Using Oxygen Plasma Ashing.
IEEE Sensors 2018, New Delhi, India; 10/2018, DOI:10.1109/ICSENS.2018.8589957

C92.C Hemanth Kumar, Asisa Kumar Panigrahi, Nirupam Paul, Satish Bonam, Siva Rama Krishna Vanjari, Shiv Govind Singh, Asisa Kumar Panigrahi:
Silicide Based Low Temperature and Low Pressure Bonding of TI/SI for Microfluidic and Hermetic Sealing Application.
2018 IEEE International Interconnect Technology Conference (IITC); 06/2018, DOI:10.1109/IITC.2018.8430450

C91.Nirupam Paul, Sudharshan Vadnala, Asisa Kumar Panigrahi, C Hemanth Kumar, Shiv Govind Singh: Vanadium Pentoxide Nanofibers as IR sensors for Bolometer Application. 05/2018

C90.Asisa Kumar Panigrahi, Hemanth Kumar C, Satish Bonam, Brince Paul K, Tamal Ghosh, Nirupam Paul, Siva Rama Krishna Vanjari, Shiv Govind Singh:
Metal-Alloy Cu Surface Passivation Leads to High Quality Fine-Pitch Bump-Less Cu-Cu Bonding for 3D IC and Heterogeneous Integration Applications.
2018 IEEE 68th Electronic Components and Technology Conference (ECTC); 05/2018, DOI:10.1109/ECTC.2018.00237

C89.Hemanth Kumar Cheemalamarri, Asisa Kumar Panigrahi, Satish Bonam, Nirupam Paul, Siva Rama Krishna Vanjari, Shiv Govind Singh:
Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper – Copper Thermocompression Bonding.
2018 IEEE 68th Electronic Components and Technology Conference (ECTC); 05/2018, DOI:10.1109/ECTC.2018.00260

C88.Nirupam Paul, Ranga R. Reddy, Radharamana Mohanty, Karthik Chanda, Sudarshan V, Swapnil Vhatkar, Asisa Kumar Panigrahi, C Hemanth Kumar, Siva Vanjari, Shiv Govind Singh:
Fabrication of Si Membrane using Frontend Bulk Micromachining.
XIX International Workshop on Physics of Semiconductor Devices, IWPSD 2017, IIT Delhi, India; 12/2017

C87.C Hemanth Kumar, Asisa Kumar Panigrahi, Satish Bonam, Nirupam Paul, Sudharshan Vadnala, Siva Vanjari, Shiv Govind Singh:
WoW Post-CMOS compatible Cu-Cu Low temperature, Low pressure thermocompression bonding with Pd passivation Engineering..
International Workshop on Physics of Semiconductor Devices -2017 (IWPSD-2017), IIT Delhi.; 12/2017

C86.Suryasnata Tripathy, Arun Naithani, Siva Rama Krishna Vanjari, Shiv Govind Singh:
Electrospun polyaniline nanofiber based chemiresistive nanobiosensor platform for DNA Hybridization detection.
IEEE Sensors 2017, Glasgow, Scotland; 11/2017, DOI:10.1109/ICSENS.2017.8234342

C85.Hemanth Kumar, Asisa Kumar Panigrahi, P. Supraja, Nirupam Paul, Shiv Govind Singh:
“Facile approach of enhanced heat mitigation between 3D stacked layers by introducing a sub-micron thick heat spreading materials" ,
Extended Abstract of the 49th International Conference on Solid State Devices and Materials, Sendai, 2017, pp. 737-738.. Facile approach of enhanced heat mitigation between 3D stacked layers by Introducing a sub-micron thick heat spreading materials, Sendai International Center, sendai, Japan.; 09/2017

C84.Sanghamitra Debroy, A. Acharyya, Shiv Govind Singh and Swati Ghosh Acharyya, "Area-efficient interlayer signal propagation in 3D IC by introducing electron spin", 23rd IEEE European Conference on Circuit Theory and Design (ECCTD), Catania, Italy, September 4-6, 2017.

C83.A Kakarla, A Qureshi, T Shashidhar, S De, SG Singh, S Jana, “Source localization via aermod-based simulation under mean squared error criterion: Demonstration using field data,” Geoscience and Remote Sensing Symposium (IGARSS), IEEE International, Fort Worth, USA, Jul 2017, pp. 6201-6204.

C82.Asisa Kumar Panigrahi, C. Hemanth Kumar, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh: Optimized ultra-thin Manganin alloy Passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC Integration. 5th IEEE Workshop on Low temperature Bonding for 3D Integration, University of Tokyo, Tokyo, Japan; 05/2017, DOI:10.23919/LTB-3D.2017.7947431

C81.Asisa Kumar Panigrahi, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh: Dual Damascene Compatible, Copper Rich Alloy Based Surface Passivation Mechanism for Achieving Cu-Cu Bonding at 150 Degree C for 3D IC Integration. 2017 IEEE 67th Electronic Components and Technology Conference (ECTC); 05/2017, DOI:10.1109/ECTC.2017.127

C80.Ranga Reddy, Brince Paul, shiv Govind singh, S R K Vanjari: Zinc oxide nanowire modified flexible plastic platform for immunosensing. IEEE SENSORS, 2016, Orlando, FL, USA; 01/2017

C79.Suryasnata Tripathy, Khandavalli Deep, Anshika Agarwal, Siva Rama Krishna Vanjari, Shiv Govind Singh: Facile, Low-cost, Halochromic Platform using Electrospun Nanofibers for Milk Adulteration Detection.. International Conference on Emerging Electronics, IIT Bombay, India; 12/2016, DOI:10.1109/ICEmElec.2016.8074615

C78.Jose Joseph, Shiv Govind Singh, Siva Rama Krishna Vanjari: Analysis of low temperature E-beam evaporated amorphous silicon thin films for MEMS applications. 2016 3rd International Conference on Emerging Electronics (ICEE); 12/2016, DOI:10.1109/ICEmElec.2016.8074635

C77.G. D. V. Santhosh Kumar, Shiv Govind Singh, Siva Rama Krishna Vanjari: Flexible, biocompatible, highly scalable, high charge density 3D Microelectrode arrays. 2016 3rd International Conference on Emerging Electronics (ICEE); 12/2016, DOI:10.1109/ICEmElec.2016.8074612

C76.Kumail Khurram, Asisa Kumar Panigrahi, Satish Bonam, Om Krishan Singh, Shiv Govind Singh: Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC. 2016 IEEE International 3D Systems Integration Conference (3DIC); 11/2016, DOI:10.1109/3DIC.2016.7970005

C75.Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh: Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration. 2016 IEEE International 3D Systems Integration Conference (3DIC); 11/2016, DOI:10.1109/3DIC.2016.7970019

C74.C. Hemanth Kumar, Asisa Kumar Panigrahi, Om Krishan Singh, Shiv Govind Singh: Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC. 2016 IEEE International 3D Systems Integration Conference (3DIC); 11/2016, DOI:10.1109/3DIC.2016.7969999

C73.Suraj Singh, Asisa Kumar Panigrahi, Om Krishan Singh, Shiv Govind Singh: Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC. 2016 IEEE International 3D Systems Integration Conference (3DIC); 11/2016, DOI:10.1109/3DIC.2016.7970000

C72.Suraj Patil, Asisa Kumar Panigrahi, Satish Bonam, C. Hemanth Kumar, Om Krishan Singh, Shiv Govind Singh: Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration. 2016 IEEE International 3D Systems Integration Conference (3DIC); 11/2016, DOI:10.1109/3DIC.2016.7970021

C71.K T Hafeez, Ashudeb Dutta, S G Singh, Krishna Kanth Gowri Avalur: Transient suppression with pseudo error voltage technique for wide supply range automotive DC-DC converters. 2016 IEEE 59th International Midwest Symposium on Circuits and Systems (MWSCAS); 10/2016, DOI:10.1109/MWSCAS.2016.7870014

C70.Brince Paul, R Ranga Reddy, Siva Rama Krishna Vanjari, Shiv Govind Singh: Zinc oxide nanowire modified flexible plastic platform for immunosensing. 2016 IEEE SENSORS; 10/2016, DOI:10.1109/ICSENS.2016.7808861

C69.Jose Joseph, Sai Saraswathi, Anshika Agarwal, Shiv Govind Singh, Siva Rama Krishna Vanjari: Silk piezoelectric thin films: Materials to devices. 2016 IEEE SENSORS; 10/2016, DOI:10.1109/ICSENS.2016.7808838

C68.Nagaveni Vamsi, Sesha Sai Ram Ragulagadda, Ashudeb Dutta, Shiv Govind Singh: A −34dBm sensitivity battery-less wake-up receiver with digital decoder. 2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS); 10/2016, DOI:10.1109/APCCAS.2016.7804076

C67.K T Hafeez, Ashudeb Dutta, S G Singh, Krishna Kanth Gowri Avalur: A compact, resource sharing on-chip soft-start technique for automotive DC-DC converters. 2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS); 10/2016, DOI:10.1109/APCCAS.2016.7803909

C66.Nagaveni Vamsi, V. Priya, Ashudeb Dutta, Shiv Govind Singh: A 1V, −26dBm sensitive auto configurable mixed converter mode RF energy harvesting with wide input range. 2016 IEEE International Symposium on Circuits and Systems (ISCAS); 05/2016, DOI:10.1109/ISCAS.2016.7538854

C65.K T Hafeez, Ashudeb Dutta, S G Singh, Krishna Kanth Gowri Avalur: A low-cost multi-phase 3A buck converter with improved ripple cancellation for wide supply range. 2016 IEEE International Symposium on Circuits and Systems (ISCAS); 05/2016, DOI:10.1109/ISCAS.2016.7538875

C64.Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh: High Quality Fine-Pitch Cu-Cu Wafer-on-Wafer Bonding with Optimized Ti Passivation at 160°C. 2016 IEEE 66th Electronic Components and Technology Conference (ECTC); 05/2016, DOI:10.1109/ECTC.2016.369

C63.Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Ramakrishna Vanjari, Shiv Govind Singh: Optimized ultra-thin Ti Passivation leads high quality fine pitch bump less Cu-Cu Wafer-on-Wafer bonding at 175˚ C. International Workshop on Physics of Semiconductor Devices (IWPSD-2015), Indian Institute of Science, Bangalore, India; 12/2015

C62.Pankaj Kumar Jha, Pravanjan Patra, Jairaj Naik, Ashudeb Dutta, Amit Acharya, Shiv Govind Singh and P. Rajalakshmi , “A 2µW Biomedical Frontend with ADC for Self-powered u-Healthcare Devices in 0.18µm CMOS”, IEEE NEWCAS 2015.

C61.Jose Joseph, G D V Santosh Kumar, Shiv Govind Singh, Siva Rama Krishna Vanjari: Free Standing, Ultra-smooth, Sacrificial Layer Independent SU-8 Membranes for MEMS applications. 18th International Workshop on Physics of Semiconductor Devices, Indian Institute of Science Bangalore, India; 12/2015

C60.Brince Paul, Durga Prakash, Shiv Govind Singh, Siva Rama Krishna Vanjari: Highly sensitive SAM modified electrospun zinc oxide nanofiber based label free biosensing platform. 2015 IEEE Sensors; 11/2015, DOI:10.1109/ICSENS.2015.7370418

C59.Nagaveni Vamsi, Akash Gupta, Ashudeb Dutta, Shiv Govind Singh: Ultra low power on-chip hybrid start-up for wireless sensor networks. 2015 Nordic Circuits and Systems Conference (NORCAS): NORCHIP & International Symposium on System-on-Chip (SoC); 10/2015, DOI:10.1109/NORCHIP.2015.7364415

C58.Nisha Gupta, Ashudeb Dutta, Shiv Govind Singh: A low/high band highly linearized reconfigurable down conversion mixer in 65nm CMOS process. 2015 Nordic Circuits and Systems Conference (NORCAS): NORCHIP & International Symposium on System-on-Chip (SoC); 10/2015, DOI:10.1109/NORCHIP.2015.7364363

C57.S. Potluri, A. Satya Trinadh, Sobhan Babu Ch., Shiv Govind Singh and V. Kamakoti, “Impact of multi-Vt technique in eliminating thermal runaway during testing of 3D chips”, Design Automation and Test in Europe,3D workshop, IEEE, 2015 (Grenoble, France).

C56.Jose Joseph, Shiv Govind Singh, Siva Rama Krishna Vanjari: Fabrication of SU-8 Based Capacitive Micromachined Ultrasonic Transducer for Low Frequency Therapeutic Applications. IEEE Engineering in Medicine and Biology, Milan, Italy; 09/2015, DOI:10.1109/EMBC.2015.7318622

C55.Pramod v Kaddi, Nagaveni Vamsi, Ashudeb Dutta, Shiv Govind Singh: A -30 dBm Sensitive Ultra Low Power RF Energy Harvesting Front End with an Efficiency of 70.1% at -22 dBm.. VLSI SOCC, Beijing; 09/2015, DOI:10.1109/SOCC.2015.7406977

C54.Nisha Gupta, A R Aravinth Kumar, Ashudeb Dutta, Shiv Govind Singh: A 1.2V wide-band reconfigurable mixer for wireless application in 65nm CMOS technology. 2015 28th IEEE International System-on-Chip Conference (SOCC); 09/2015, DOI:10.1109/SOCC.2015.7406908

C53.R Ranga Reddy, Sugandh Tanna, shiv Govind singh, Om Krishna singh: TSV noise coupling in 3D IC using guard ring. 2015 IEEE 3D IC Conference, At Sendai, Japan; 09/2015, DOI:10.1109/3DIC.2015.7334606

C52.Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh: Long term Efficacy of ultrathin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer Bonding. 2015 IEEE 3D IC Conference, Sendai, Japan; 09/2015, DOI:10.1109/3DIC.2015.7334582

C51.Pankaj Jha, Pravanjan Patra, Jairaj Naik, Amit Acharya, P. Rajalakshmi, Shiv Govind Singh, Ashudeb Dutta: A reconfigurable medically cohesive biomedical front-end with ΣΔ ADC in 0.18µm CMOS. 2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC); 08/2015, DOI:10.1109/EMBC.2015.7318491

C50.Shourya Kansal, Ajay Mantha, Y. B. Priyamvada, Gajendranath Chowdary, S. G. Singh, Ashudeb Dutta: A wide input voltage range start-up circuit for solar energy harvesting system. 2015 6th Asia Symposium on Quality Electronic Design (ASQED); 08/2015, DOI:10.1109/ACQED.2015.7274031

C49.Pramod v Kaddi, N. Vamsi ·, A. Appala, A. Dutta, S.G. Singh, N. Nallam: Efficient Dual Band RF Energy Harvesting Front End for Ultra Low Power Sensitive Passive Wearable Devices. IEEE ISED 5th International Conference, NIT Surathkal; 07/2015

C48.Pankaj kumar Jha, Pravanjan Patra, Jairaj Naik, Asudeb Dutta, Shiv Govind Singh: A 2uW Biomedical Frontend with ADC for Self-powered u-Healthcare Devices in 0.18m CMOS. 13th IEEE International NEW Circuits And Systems (NEWCAS) conference Grenoble, France; 06/2015

C47.Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh: Low Temperature, Low Pressure CMOS Compatible Cu-Cu Thermo-compression Bonding With Ti Passivation For 3D IC Integration. Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th, USA; 05/2015, DOI:10.1109/ECTC.2015.7159909

C46.Krushnamurty Killi, Tamal Ghosh, Ch. Subrahmanyam, V. Siva Rama Krishna, A. Dutta, S G Singh: Room temperature desorption of Self Assembled Monolayer from Copper surface for low temperature & low pressure thermocompression bonding. Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th; 05/2015, DOI:10.1109/ECTC.2015.7159908

C45.A R Aravinth Kumar, Shiv Govind Singh, Ashudeb Dutta: Low power reconfigurable multi-mode LNA utilizing sub-threshold bias and low-Q inductors. 2015 IEEE International Symposium on Circuits and Systems (ISCAS); 05/2015, DOI:10.1109/ISCAS.2015.7168717

C44.Satya A. Trinadh, Sobhan Babu Ch, Shiv Govind Singh, Seetal Potluri, Kamakoti V.: Dp-Fill: A Dynamic Programming Approach to X-Filling for Minimizing Peak Test Power in Scan Tests. Design, Automation and Test in Europe; 01/2015, DOI:10.7873/DATE.2015.0134.

C43.Pankaj Jha, Pravanjan Patra, Jairaj Naik, Ashudeb Dutta, Amit Acharya, P. Rajalakshmi, Shiv Govind Singh: A 2μW biomedical frontend with ΣΔ ADC for self-powered U-healthcare devices in 0.18μm CMOS technology. DOI:10.1109/NEWCAS.2015.7182054.

C42.Rohit Shrivastava, Kavya Nalluri, Ashudeb Dutta, Siva Rama Krishna, Shiv Govind Singh, Microfluid based Energy Harvesting Device simulation & optimization, ICEE 2014, IISC Bangalore, Dec 3-6 2014.

C41.Brince Paul, Chandra Shekhar Sharma, Shiv Govind Singh, Siva Ramakrishna Vanjari: Fabrication and characterization of zinc oxide nanowires for high-sensitivity sensing applications. DOI:10.1109/ICEmElec.2014.7151162.

C40.Durga Prakash, Siva Rama Krishna V, Asudeb Dutta, C.S. Sharma, Shiv Govind Singh: Development of MWCNT/SU-8 Nanofiber Composite Using Electrospinning Technique for Biosensing Applications. IEEE SENSORS 2014, Valencia, Spain; 11/2014, DOI:10.1109/ICSENS.2014.6985449

C39.Jose Joseph, Shiv Govind Singh, Siva Rama Krishna Vanjari: A Low Pull-in SU-8 based Capacitive Micromachined Ultrasonic Transducer for Medical Imaging Applications. 36th IEEE EMBC, Chicago, USA; 08/2014, DOI:10.1109/EMBC.2014.6943861

C38.G.C. Gagan, Shiv Govind Singh, Ashudeb Dutta: Optimized ttsv structure for heat mitigation and energy harvesting. DOI:10.1109/ICSICT.2014.7021616.

C37.Tamal Ghosh, V Siva Rama Krishna, Shiv Govind Singh: Low temperature Cu-Cu thermocompression bonding assisted by electrochemical desorption of a self-assembled monolayer. DOI:10.1109/ICEmElec.2014.7151165.

C36.Radharamana Mohanty, Chanda Karthik, Siva Rama Krishna V, Shiv Govind Singh, Area Effective Silicon Micro Structure Only Using Front End Bulk Micro Machining, , ICMEMS 2014, Chennai, Dec 18 -20, 2014.

C35.Pramod Kaddi, Basireddy Karunakar Reddy, Shiv Govind Singh: Active Cooling Technique for Efficient Heat Mitigation in 3D-ICs. Proceedings of the 2014 27th International Conference on VLSI Design and 2014 13th International Conference on Embedded Systems; 01/2014, DOI:10.1109/VLSID.2014.92

C34.Durga Prakash, Siva Rama, Shiv Govind Singh, Asudeb Dutta, Chandra S Sharma, Y Chen: Preparation and Electrical Characterization of Electrospun Multi-Wall Carbon Nanotubes embedded conductive SU-8 nanofibers. 17TH INTERNATIONAL WORKSHOP ON THE PHYSICS OF SEMICONDUCTOR DEVICES(IWPSD 2013) December 10-13; 12/2013

C33.Nisha Gupta, A R Aravinth Kumar, Ashudeb Dutta, Shiv Govind Singh: Design of sub-threshold wide band down conversion mixer. 2013 IEEE Postgraduate Research in Microelectronics and Electronics Asia (Prime Asia); 12/2013, DOI:10.1109/PrimeAsia.2013.6731205

C32.K T Hafeez, A Dutta, S G Singh, K Shiva Kumar, Krishna Kanth Avalur, V H Sai: Hybrid structured buck converter with ripple cancellation and improved efficiency. 2013 Annual IEEE India Conference (INDICON); 12/2013, DOI:10.1109/INDCON.2013.6726113

C31.M. Durga Prakash, Siva Rama Krishna V, Shiv Govind Singh, Asudeb Dutta, C.S. Sharma: Preparation and Physicochemical characterization of Multi Walled Carbon Nanotube (MWCNT) embedded SU-8 electrospun nanofibers. SETCOR International Conference on Nanotechnology Dubai 2013 NANOTECH DUBAI 2013; 10/2013

C30.Aditya Vikram Singh, Divanshu Chaturvedi, Shiv Govind Singh, Mohammed Zafar Ali Khan: Power dissipation analysis for different configurations of TSVs at high (GHz) frequencies. Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd; 05/2013, DOI:10.1109/ECTC.2013.6575913.

C29.Shabaz Basheer Patel, Tamal Ghosh, Asudeb Dutta, Shiv Govind Singh: Stress analysis in 3D IC having Thermal Through Silicon Vias (TTSV). Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd; 05/2013, DOI:10.1109/ECTC.2013.6575910

C28.Aftab Alam Khan, Yoshihiro Ohnari, Ashudeb Dutta, Shiv Govind Singh, Mitiko Miura-Mattausch, Hans Jurgen Mattausch: Die-to-die and within-die fabrication variation of 65nm CMOS technology PMOS transistors. Electronics, Computing and Communication Technologies (CONECCT), 2013 IEEE International Conference on; 01/2013, DOI:10.1109/CONECCT.2013.6469286

C27.Tamal Ghosh, Ashudeb Dutta, Shivgovind Singh, Copper Protection by SAM and Low Temperature Bonding for 3Dimentional Integration, 3dimentional Integration. In: 2nd International Conference on Materials Science and Technology, ICMST 2013, 11-12, April 2013, Hong Kong; China.

C26.Vijai D., Shiv Govind Singh and Amit Agrawal Study of liquid flow through non-uniform cross section microchannel NCFMFPDec. 2012.

C25. Amit Prabhakar, Y V Bala, Varun Kumar, Siddhartha Tripathi, Shiv Govind Singh and Amit Agrawal, A Novel, Compact and Efficient Microfluidic Device for Blood Plasma Separation, , NCFMFP, Dec. 2012.

C24.S Pradeep Reddy, Ashudeb Dutta, Shiv Govind Singh: A reconfigurable aperture coupled microstrip patch antenna with beam steering capability on silicon. Circuits and Systems (APCCAS), 2012 IEEE Asia Pacific Conference on; 12/2012, DOI:10.1109/APCCAS.2012.6419036

C23.Pankaj Kumar Jha, Ashudeb Dutta, Y.B. Nithin Kumar, Shiv Govind Singh: Modeling an IF double sampling bandpass switched capacitor ΣΔ ADC with a symmetric noise transfer function for WiMAX/WLAN. Computers and Devices for Communication (CODEC), 2012 5th International Conference on; 12/2012, DOI:10.1109/CODEC.2012.6509222

C22.Shashi Ketan Samal, Ashudeb Dutta, S Pradeep Reddy, Santanu Dwari Shiv, Govind Singh A Microstrip Patch Antenna for Biomedical application at 2.45GHz”, CODEC Dec. 2012, Kolkata, India

C21.A R Aravinth Kumar, Ashudeb Dutta, Shiv Govind Singh: Transformer coupled novel noise cancellation technique for sub-threshold UWB LNA. Computers and Devices for Communication (CODEC), 2012 5th International Conference on; 12/2012, DOI:10.1109/CODEC.2012.6509213

C20.Aftab Alam Khan, Shabaz Basheer Patel, Divanshu Chaturvedi, Ashudeb Dutta, Shiv Govind Singh: Targeted cooling with CVD diamond and micro-channel to meet 3-D IC heat dissipation challenge. Emerging Electronics (ICEE), 2012 International Conference on; 12/2012, DOI:10.1109/ICEmElec.2012.6636254

C19.Shaik Shabana, Chandra Thej, Hari Sankar, Rajesh Pandava, Ashudeb Dutta, S.G. Singh: Design of highly efficient charge pump for energy harvesting RFID applications. Microelectronics and Electronics (Prime Asia), 2012 Asia Pacific Conference on Postgraduate Research in; 12/2012, DOI:10.1109/PrimeAsia.2012.6458625

C18.Tamal Ghosh, E. Linga Reddy, Ch. Subrahmanyam, Ashudeb Dutta, Shiv Govind Singh: Room temperature desorption of Self Assembly Monolayer (SAM) passivated Cu for lowering the process temperature Cu-Cu bonding of 3-D ICs. IEEE, International Conference on Emerging Electronics (ICEE-2012); 12/2012, DOI:10.1109/ICEmElec.2012.6636262

C17.K.T. Hafeez, Ashudeb Dutta, Shiv Govind Singh: Efficient adaptive switch design for charge pumps in micro-scale energy harvesting. VLSI and System-on-Chip (VLSI-SoC), 2012 IEEE/IFIP 20th International Conference on; 10/2012, DOI:10.1109/VLSI-SoC.2012.6379054

C16.Saddi Pradeep Reddy , Ashudeb Dutta and Shiv Govind Singh , A Reconfigurable Aperture Coupled Microstrip Patch Antenna on Silicon, IEEE conference , HSIC2012, May-2012, China.

C15.A R Aravinth Kumar, Ashudeb Dutta and Shiv Govind Singh “Noise-Cancelled Subthreshold UWB LNA for Wireless Sensor Network Application”, 2012 IEEE International Conference on Ultra-Wideband (ICUWB),vol., no., pp.383,386, 17-20 Sept. 2012, Syracuse, USA.

C14.Trivikrama Rao, Ashudeb Dutta, Shiv Govind Singh, Arijit De, Bhibu Dutta Sahoo: A Tunable CMOS Pulse Generator for Detecting the Cracks in Concrete Walls. Proceedings of the 2012 IEEE Computer Society Annual Symposium on VLSI; 08/2012, DOI:10.1109/ISVLSI.2012.20

C13.R. Sai Chandra Teja, Sachin Kalia, Ashudeb Dutta, Shiv Govind Singh: Phase noise reduction of an oscillator using harmonic mixing technique. Circuits and Systems (MWSCAS), 2012 IEEE 55th International Midwest Symposium on; 08/2012, DOI:10.1109/MWSCAS.2012.6291990

C12.A.R. Aravinth Kumar, Ashudeb Dutta, Shiv Govind Singh: A 1.5–7.5GHz low power low noise amplifier (LNA) design using sub threshold technique for Wireless Sensor Network (WSN) application. Circuits and Systems (ISCAS), 2012 IEEE International Symposium on; 05/2012, DOI:10.1109/ISCAS.2012.6271655

C11.Dau Fatt Lim, Shiv Govind Singh, Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan: Application of Self Assembly Monolayer (SAM) in lowering the process temperature during Cu-Cu diffusion bonding of 3D IC. Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International; 11/2009, DOI:10.1109/IMPACT.2009.5382311

C10.Shiv Govind Singh, Chuan Seng Tan: Thermal mitigation using thermal through silicon via (TTSV) in 3-D ICs. Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International; 11/2009, DOI:10.1109/IMPACT.2009.5382145

C9.Dau Fatt Lim, Shiv Govind Singh, Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan: Achieving low temperature Cu to Cu diffusion bonding with self-assembly monolayer (SAM) passivation. IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009; 09/2009, DOI:10.1109/3DIC.2009.5306545

C8.S.G. Singh, L.D. Fatt , C.S. Tan, Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation, AMC, Oct, Baltimore, USA, 2009.

C7.Shiv Govind Singh, Chuan Seng Tan: Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack. IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009; 09/2009, DOI:10.1109/3DIC.2009.5306527

C6.A. Modi., P. Gandhi, H. Saha, and S.G. Singh, Design, Analysis and Fabrication of Microflexural NOT Gate, ASME International Mechanical Engineering Congress and Exposition November 11-15, 2007, Seattle, Washington, USA.

C5.A. Modi., P. Gandhi, H. Saha, C. Amarnath, and S.G. Singh, Design, Analysis and Fabrication of Microflexural AND Gate, 13 th National Conference on Mechanisms and Machines, IISc Bangalore, India, Dec 12-13, 2007.

C4.Abhishek Modi, Himani Shah, C Amarnath, Prasanna S. Gandhi, Shiv Govind Singh, Ritu Rashmi: Design, Analysis and Fabrication of a Microflexural AND Gate. DOI:10.1115/IMECE2007-41713.

C3.S. G. Singh, S. P. Duttagupta, A. M. Kulkarni, B. P. Puranik, A. Agrawal: Experimental Study of Flow Boiling in Microchannel. ASME 2007 5th International Conference on Nano-channels, Microchannels, and Mini channels; 01/2007, DOI:10.1115/ICNMM2007-30130

C2.S.G. Singh , S. P. Duttagupta, A. Bhattacharya, and N. Maiti, Fabrication and characterization of Integrated Microchannel and Microheater, Proceedings of CFMFP2006, 33rd National and 3rd International Conference on Fluid Mechanics and Fluid Power, December 7-9, 2006, Mumbai, India.

C1.S.G. Singh, S. P. Duttagupta, A. Kulkarni, B. P. Puranik, and A. Agrawal, Experimental study of nucleate boiling in microchannel, Proceedings of NCFMFP2006, 33rd National and 3rd International Conference on Fluid Mechanics and Fluid Power, December 7-9, 2006, Mumbai, India.